Thermoelectrics: an engineering sector arising out of developments built around the Seeback & Peltier effects.
Result: Solid-state semiconductor devices that can carry out heat pumping upon application of an electric potential, or deliver an electric potential upon application of a temperature difference across the device.
![]() | Finish | Surface lapped |
![]() | Size | 13mm x 13mm to 62mm x 62mm |
![]() | Thickness | 3.3mm to 4.4mm |
![]() | Voltage (max) | 1V to 30V |
![]() | Current (max) | 0.5A to 25A |
![]() | Delta T (max) | 60° C. to 71° C. |
![]() | Max T (operation) | 80° C., 100° C., 125° C., 150° C., 200° C. |
![]() | Sealing | Epoxy, RTV |
![]() | Cooling Power (Heat Pumping) | 1W to 250W (nominal) |
![]() | Power Generator | upto 5W/module (depends on operational condition) |
Heat Sink |
---|
Bonded (fin) |
Machined (fin/pin) |
W | H | T |
60 | 60 | 20 |
90 | 90 | 25 |
50 | 50 | 5 |
92 | 92 | 38 |
92 | 92 | 38 |
Thermal Grease |
---|
Temperature upto |
150° C |
180° C |
300° C |
Insulation foam PE (mm thk.) |
---|
6 |
13 |
19 |
25 |
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