Thermoelectrics: an engineering sector arising out of developments built around the Seeback & Peltier effects.
Result: Solid-state semiconductor devices that can carry out heat pumping upon application of an electric potential, or deliver an electric potential upon application of a temperature difference across the device.
Finish | Surface lapped | |
Size | 13mm x 13mm to 62mm x 62mm | |
Thickness | 3.3mm to 4.4mm | |
Voltage (max) | 1V to 30V | |
Current (max) | 0.5A to 25A | |
Delta T (max) | 60° C. to 71° C. | |
Max T (operation) | 80° C., 100° C., 125° C., 150° C., 200° C. | |
Sealing | Epoxy, RTV | |
Cooling Power (Heat Pumping) | 1W to 250W (nominal) | |
Power Generator | upto 5W/module (depends on operational condition) |
Heat Sink |
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Bonded (fin) |
Machined (fin/pin) |
W | H | T |
60 | 60 | 20 |
90 | 90 | 25 |
50 | 50 | 5 |
92 | 92 | 38 |
92 | 92 | 38 |
Thermal Grease |
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Temperature upto |
150° C |
180° C |
300° C |
Insulation foam PE (mm thk.) |
---|
6 |
13 |
19 |
25 |
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